Best for
PCB designers, hardware and manufacturing engineers
Works with SMT and through‑hole designs and common EDA exports
AI writing assistant for hardware teams
Convert messy BOM CSVs, Gerber/drill sets, and P&P data into structured manufacturing packs, clear assembly steps, standardized review checklists, and supplier-ready RFQs — ready to drop into fabrication and assembly workflows.
Best for
PCB designers, hardware and manufacturing engineers
Works with SMT and through‑hole designs and common EDA exports
Common outputs
Manufacturing pack index, CSV-ready BOM, fab notes, assembly steps
Files and copy formatted for vendor upload and shop instructions
Handoff friction
PCB design teams lose time rewriting engineering notes into clear manufacturing and procurement artifacts. This assistant provides domain-focused prompt templates that transform EDA exports and short design notes into consistent BOMs, fabrication instructions, assembly sequences, and review checklists that vendors and internal teams can act on without repeated clarification.
Practical templates
Templates are grouped by common handoff artifacts. Each prompt has explicit input fields that map to typical EDA outputs (BOM CSV, Gerber set name, P&P file) so you can paste or attach exports and get immediately usable copy or CSV-format outputs.
INPUT: componentized BOM CSV + board revision note. OUTPUT: manufacturing pack index (files list), one-paragraph board summary for the fab, explicit Gerber/drill file naming, and assembly house instructions.
INPUT: raw BOM CSV from EDA. Prompt normalizes RefDes conventions, adds Manufacturer and Alternate placeholders, groups by procurement priority, flags obsolete parts, and outputs CSV with standard columns.
INPUT: P&P filename + board notes. OUTPUT: step-by-step SMT sequence, nozzle recommendations, critical orientation notes, glue zones, and wave-solder instructions for through-hole sections.
INPUT: Gerber set name + layer list. OUTPUT: fab notes including stackup summary, controlled impedance hints, drill tolerances, inner-layer clearances, and recommended soldermask expansion.
INPUT: short design intent (e.g., high-speed, power management). OUTPUT: prioritized checklist covering signal integrity, power integrity, thermal, mechanical keepouts, and testpoint coverage.
INPUT: functional blocks and critical nets. OUTPUT: factory test plan (smoke and functional tests), fixture probe points, expected voltages, and debugging tips.
INPUT: list of changes. OUTPUT: ECO entry with rationale, affected assemblies, migration steps for BOM and Gerber, and sample commit message.
INPUT: part numbers and uncertainty fields. OUTPUT: concise supplier questions, footprint confirmation requests, packaging/lead-time constraints for RFQs.
INPUT: obsolete part + function. OUTPUT: candidate substitutes with matched critical parameters and suggested verification tests.
INPUT: PASTE layer data. OUTPUT: stencil aperture recommendations, step-down guidance for fine pitch, and paste inspection checklist.
From export to pack
Use the provided prompt templates and map your EDA outputs to the input placeholders. Start with the smallest useful inputs (BOM CSV + revision note) and iterate to add Gerber names, P&P filenames, or board images for higher fidelity outputs.
Vendor-friendly
Outputs are formatted for real handoffs: CSV columns ready for procurement systems, short plain‑text fab instructions that map to file names, step-by-step assembly sequences, and checklist items with acceptance criteria. Each template includes placeholders you can fill with datasheet links, manufacturer names, and file references.
EDA compatibility
Templates and prompts are designed to accept artifacts from common PCB toolchains. Map your tool outputs to the prompt inputs to get the best results.
Reusable snippets
Below are short, copy-pasteable prompts. Replace bracketed placeholders with your files or short notes.
INPUT: paste raw BOM CSV below and add REVISION_NOTE. OUTPUT: normalized CSV with Manufacturer and Alternate placeholders.
INPUT: GERBER_SET_NAME + LAYER_LIST. OUTPUT: concise fab notes.
INPUT: P&P_FILENAME + BOARD_NOTES. OUTPUT: step-by-step assembly sequence.
Best practices
Small changes in input discipline significantly improve output quality. Use these practices to get manufacturing-ready artifacts without multiple iterations.
Next steps
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Read examples of how other hardware teams use templates.
Paste the raw BOM CSV into the BOM Cleanup & Normalization prompt and include a one-line revision note. The template normalizes RefDes formatting, adds columns for Manufacturer and Alternate1, flags missing part numbers, and returns a CSV with columns ready for upload to procurement systems. If manufacturer data is missing, the output will include placeholders you can use to populate supplier queries.
Yes. Provide the Gerber set name and layer list (e.g., TopCopper, BottomCopper, Drill). The Fabrication Notes prompt returns concise fab instructions that reference file names and suggested stackup and tolerance notes formatted for vendor handoff. Always confirm final tolerances with your chosen fab.
Minimal useful input is a BOM CSV plus a one‑line revision note. For higher-fidelity outputs, add Gerber set names, layer lists, P&P filenames, and short board notes (glue zones, heat-critical parts). Include any uncertainties (e.g., unknown manufacturer) as flagged fields so the prompts can generate supplier questions or alternates.
Provide functional blocks and critical nets as inputs. The Test Plan prompt outputs smoke and functional test steps, fixture probe points, expected voltages, and pass/fail criteria. Map the probe point names to your ATE fixtures and translate suggested voltages and thresholds into your tester's format before automating.
The Compliance & IPC Notes template summarizes relevant checklist items for a target standard (e.g., IPC-6012) and recommends inspection points. Use these outputs as a drafting aid: verify specific compliance acceptance criteria and required vendor documentation against the standard or your QA team before submission.
Where supported, attach P&P filenames and paste schematic snippets or link board images in the input. The prompts interpret filenames and short text snippets; for images, include a brief caption describing the area of interest (e.g., 'power section, U5 area'). More contextual inputs yield more precise assembly and test outputs.
Provide a concise list of changes and a short rationale per change. Use the ECO prompt to generate a structured entry with affected RefDes, migration steps for BOM and Gerber, and a suggested commit message. Keep a consistent ECO template (change_id, author, rationale, affected_refs, migration_steps) in your repository to maintain traceability.
Include part numbers and any uncertain fields in the Supplier Query prompt. The output will craft concise questions for suppliers, request footprint confirmations, specify acceptable tolerances, and outline preferred packaging and lead-time constraints. Use the generated text as the body of your RFQ to reduce back-and-forth with suppliers.